§ 30-253.9. Authorization and form of bonds.  


Latest version.
  • Bonds may be authorized by resolution or resolutions of the board which shall be adopted by a majority of all of the members thereof then in office. Such resolution or resolutions may be adopted at the same meeting at which they are introduced, and need not be published or posted. The board may by resolution authorize the issuance of bonds [and] fix the aggregate amount of bonds to be issued; the purpose or purposes for which the moneys derived therefrom shall be expended, the rate or rates of interest, not to exceed the highest rate allowed by law; the denomination of the bonds; whether or not the bonds are to be issued in one (1) or more series; the date or dates of maturity, which shall not exceed forty (40) years from their respective dates of issuance; the medium of payment; the place or places within or without the state where payment shall be made; registration privileges; redemption terms and privileges (whether with or without premium); the manner of execution; the form of the bonds, including any interest coupons to be attached thereto; the manner of execution of bonds and coupons, and any and all other terms, covenants and conditions thereof; and the establishment of revenue or other funds. Such authorizing resolution may further provide that such bonds may be executed manually or by engraved, lithographed or facsimile signature, provided that where signatures are engraved, lithographed or facsimile, no bond shall be valid unless countersigned by a registrar or other officer designated by appropriate resolution of the board. The seal of the district may be affixed, lithographed, engraved or otherwise reproduced in facsimile on such bonds. In case any officer whose signature shall appear on any bonds or coupons shall cease to be such officer before the delivery of such bonds, such signature or facsimile shall nevertheless be valid and sufficient for all purposes the same as if he had remained in office until such delivery.

(Sp. Acts, Ch. 82-274, § 24)